本书是一本介绍现代VLSI芯片设计过程的书籍,改编自PEARSON EDUCATION 出版的Modern VLSIDesign: System-on-Chip Design 3/e一书。书中全面地论述了VLSI芯片设计的有关问题，反映了目前SoC的最新进展，并介绍了SoC的设计方法。全书共分10章。内容包括：数字系统与VLSI，晶体管的版图设计，逻辑门，组合逻辑网络，时序电路，子系统设计，自顶向下设计，系统设计，芯片设计，CAD系统及算法，另有3个附录。每章末尾均附有难度不同的习题。附录中还提供了丰富而实用的词汇表。改编者保持原书的风格和原有体系结构，根据国内的教学要求和课程设置，调整了原书的一些内容，使之更适合我国高等学校作为教材使用。 本书可作为高校电子工程、计算机科学与工程、微电子半导体等专业的高年级本科生和研究生的教材或教学参考书，也可供从事芯片设计的工程技术人员作为参考书使用。

Preface to the Third Edition
Preface to the Second Edition
Preface
1 Digital Systems and VLSI
  1.1 Why Design Integrated Circuits?
  1.2 Integrated Circuit Manufacturing
   1.2.1 Technology
   1.2.2 Economics
  1.3 CMOS Technology
   1.3.1 CMOS Circuit Techniques
   1.3.2 Power Consumption
   1.3.3 Design and Testability
  1.4 Integrated Circuit Design Techniques
   1.4.1 Hierarchical Design
   1.4.2 Design Abstraction
   1.4.3 Computer-Aided Design
  1.5 A Look into the Future
  1.6 Summary
  1.7 References
  1.8 Problems
2 Transistors and Layout
  2.1 Introduction
  2.2 Fabrication Processes
   2.2.1 Overview
   2.2.2 Fabrication Steps
  2.3 Transistors
   2.3.1 Structure of the Transistor
   2.3.2 A Simple Transistor Model
   2.3.3 Transistor Parasitics
   2.3.4 Tub Ties and Latchup
   2.3.5 Advanced Transistor Characteristics
   2.3.6 Leakage and Subthreshold Currents
   2.3.7 Advanced Transistor Structures
   2.3.8 Spice Models
  2.4 Wins and Viaa
   2.4.1 Wire Parasitics
   2.4.2 Skin Effect in Copper Interconnect
  2.5 Design Rules 74
   2.5.1 Fabrication Errors
   2.5.2 Scalable Design Rules
   2.5.3 SCMOS Design Rules
   2.5.4Typical Process Parameters
  2.6 Layout Design and Tools
   2.6.1 Layouts for Circuits
   2.6.2 Stick Diagrams
   2.6.3 Layout Design and Analysis Tools
   2.6.4 Automatic Layout
  2.7 References
  2.8 Problems
3 Logic Gates
  3.1 Introduction
  3.2 Static Complementary Gates
   3.2.1 Gate Structures
   3.2.2 Basic Gate Layouts
   3.2.3 Logic Levels
   3.2.4 Delay and Transition Time
   3.2.5 Power Consumption
   3.2.6 The Speed-Power Product
   3.2.7 Layout and Parasitics
   3.2.8 Driving Large Loads
  3.3 Switch Logic
  3.4 Alternative Gate Circuits
   3.4.1 Pseudo-nMOS Logic
   3.4.2 DCVS Logic
   3.4.3 DominoLogic
  3.5 Low-Power Gates
  3.6 Delay Through Resistive Interconnect
   3.6.1 Delay Through an RC Transmission Line
   3.6.2 Delay Through RC Trees
   3.6.3 Buffer Insertion in RC Transmission Lines
   3.6.4 Crosstalk Between RC Wires
  3.7 Delay Through Inductive Interconnect
   3.7.1 RLC Basics
   3.7.2 RLC Transmission Line Delay
   3.7.3 Buffer Insertion in RLC Transmission Lines
  3.8 References
  3.9 Problems
4 Combinational Logic Networks
  4.1 Introduction
  4.2 Standard Cell-Based Layout
   4.2.1 Single-Row Layout Design
   4.2.2 Standard Cell Layout Design
  4.3 Simulation190
  4.4 Combinational Network Delay
   4.4.1 Fanout
   4.4.2 Path Delay
   4.4.3 Transistor Sizing
   4.4.4 Automated Logic Optimization
  4.5 Logic and Interconnect Design
   4.5.1 Delay Modeling
   4.5.2 Wire Sizing
   4.5.3 Buffer Insertion
   4.5.4 Crosstalk Minimization
  4.6 Power Optimization
   4.6.1 Power Analysis
  4.7 Switch Logic Networks
  4.8 Combinational Logic Testing
   4.8.1 Gate Testing
   4.8.2 Combinational Network Testing
  4.9 References
  4.10 Problems
5 Sequential Machines
  5.1 Introduction
  5.2 Latches and Flip-Flops
   5.2.1 Categories of Memory Elements
   5.2.2 Latches
   5.2.3 Flip-Flops
  5.3 Sequential Systems and Clocking Disciplines
   5.3.1 One-Phase Systems for Flip-Flops
   5.3.2 Two-Phase Systems for Latches
   5.3.3 Advanced Clocking Analysis
   5.3.4 Clock Generation
  5.4 Sequential System Design
   5.4.1 Structural Specification of Sequential Machines
   5.4.2 State Transition Graphs and Tables
   5.4.3 State Assignment
  5.5 Power Optimization
  5.6 Design Validation
  5.7 Sequential Testing
  5.8 References
  5.9Probllems
6 Subsystem Design
  6.1Introduction
  6.2 Subsystem Design Principles
   6.2.1 Pipelining
   6.2.2 Data Paths
  6.3 Combinational Shifters
  6.4 Adders
  6.5 ALUs
  6.6 Multipliers
  6.7 High-Density Memory
   6.7.1 ROM
   6.7.2 Static RAM
   6.7.3 The Tluee-Transistor Dynamic RAM
   6.7.4 The One-Transistor Dynamic RAM
  6.8 Refertnces
  6.9 Problems
7 Floorplanning
  7.1 Introduction
  7.2 Floorplanning Methods
   7.2.1 Block Placement and Channel Definition
   7.2.2 Global Routing
   7.2.3 Switchbox Routing
   7.2.4 Power Distribution
   7.2.5 Clock Distribution
   7.2.6 Floorplanning'Dps
   7.2.7Design Validation
  7.3 Off-Chip Connections
   7.3.1 Packages
   7.3.2 The I/O Architecture
   7.3.3 Pad Design
  7.4 References
  7.5PProblems
8 Architecture Design
  8.1 Introduction
  8.2 Hardware Description Languages
   8.2.1 Modeling with Hardware Description Languages
   8.2.2 VHDL
   8.2.3 Verilog
   8.2.4 Cas a Hardware Description Language
  8.3 Register-Transfer Design
   8.3.1 Data PaI-Controller Architectures
   8.3.2 ASM Chart Design
  8.4 High-level Synthesis
   8.4.1 Functional Modeling Programs
   8.4.2 Data
   8.4.3 Control
   8.4.4 Data and Control
   8.4.5 Design Methodology
  8.5 Architectures for Low Power
   8.5.1 Architecture-Driven Voltage Scaling
   8.5.2 Power-Down Modes
  8.6 Systems-on-Chips and Embedded CPUs
  8.7 Architecture Testing
  8.8 References
  8.9 Problems
9 Chip Design
  9.1 Introduction
  9.2 Design Methodologies
  9.3 Kitchen Timer Chip
   9.3.1 Tina Specification and Architecture
   9.3.2 Architecture Design
   9.3.3 Logic and Layout Design
   9.3.4 Design Validation
  9.4 Microrocessor Data Path
   9.4.1 Datapath Organization
   9.4.2 Clocking and Bus Design
   9.4.3 Logic and Layout Design
  9.5 References
  9.6 Problems
10 CAD Systems and Algorithms
  10.1 Introduction
  10.2 CAD Systems
  10.3 Switch-Lemma Simulation
  10.4 Layout Synthesis
   10.4.1 Placement
   10.4.2 Global Routing
   10.4.3 Detailed Routing
  10.5 Layout Analysis
  10.6 Tuning Analysis and OPtimization
   10.7 Logic Syonthiesis
   10.7.1 Technology-Independent Logic Optimization
   10.7.2 Technology-Dependent LogicOPtimizations
  10.8 Test Generation
  10.9 Sequential Machine Optimlzations
  10.10 Scheduling and Binding
  10.11 Hardware/Softwam Co-Design
  10.12 References
  10.13 Problems
A Chip Designer's Lexicon
B Chip Design Projects
  B.1 Class Project Ideas
  B.2 Project Proposal and Specification
  B.3 Design Plan
  B.4 Design Checkpoints andDocumentation
   B.4.1 Subsystems Check
   B.4.2 Fast Layout Check
   B.4.3 Project Completion
C Kitchen Timer Model
  C.1 Hardware Modeling in C
   C.1.1 Simulator
   C.1.2 Sample Execution
References
Index